Technique advantage of Epimx packaging injection machine
The Epimx is the very first packaging injection machine using plunger injection system (patent pending approval), unlike conventional packaging machine using pump for packaging, by precise servo motor and computer calculations allowed user to set parameter for different kinds of products, with precise clamping unit controlled by servo motor that makes packaging injection more precise, and easier. Epimx is your best choice that provides the most precise techniques and deliver the best service.
Introduction of hot melt adhesive
Hot melt adhesive is resin with no volatilize, solid status in normal temperature, after melting, it becomes stable and hard to carbonized adhesive. After cured, the adhesion is widely used in auto, electric, medical industry application for sensor and water-proof packaging. For PC usage, it could be the protection packaging that is faster, more precise in a small working station than traditional dispensing process and has become the new material for packaging process.
Epimx Hot melt adhesive packaging injection method
Epimx hot melt adhesive packaging injection method is to melt solid adhesive granule into liquid status by electric heating then injected by computer controlled plunger into package inserted electronic device, after cooling, it turns into a flat package status. the features are precise low pressure control, fast cooling molding, high efficiency with low product cost. It can reach the insulation, water proof, dust proof, shock proof, pollution proof and weatherability requirements.
Comparison table of Epimx Packaging Machine and Traditional Packaging Machine
Epimx Packaging Machine
Traditional Packaging Machine
Packaging power type
Packaging power adjustment 3
3 stages injection / 2 stages holding pressure
1 stage torque
Clamping power type
barrel 1 set / nozzle 1set / tank 2 set
barrel 1 set / tank 1 set
Hot melt adhesive features
1~50 bar extreme low inj. pressure, electric device never breaks.
1~15 KN clamping force for protecting products.
150~220。C low temperature melt adhesive, chip never breaks.
High packaging quality by servo motor inj. and JPN computer control system.
Servo motor for clamping unit, stable action and precise control mold venting.
10~60 second cycle time reduce packaging cost.
Product packaged after taking out from the machine, save more space.
Precise and durable by using JPN servo motor and computer
vertical servo motor clamping system.
Horizontal parting line injection system.
Sevor motor and air pressure system.
FUJI 7” full color TFT-LCD touch panel controller.
3 stages injection 2 stage holding pressure and 100 mold data can be saved.
All-electic injection system, the most precise packaging quality.
Dual protection of restart button and safty light curtains.